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2025-04-01-rising

  • 精選方式: RISING

討論重點​

以下是24篇討論重點的條列式總結，並附上對應的文章錨點連結與逐條細節：

1. 台積電血汗工廠爭議​

  • 核心議題：批評台積電高壓工作文化
    • 細節：
      1. 美國廠區勞動條件被比擬為「血汗工廠」，工時長且無休假日。
      2. 擔憂市場壟斷導致工程師職涯選擇受限。
      3. 批判東亞「割喉式競爭」文化僅利股東，犧牲員工權益。

2. 俄羅斯半導體技術落後​

  • 核心議題：俄國EUV技術發展困境
    • 細節：
      1. 僅能生產90奈米晶片（落後國際15年）。
      2. 缺乏ASML級設備，EUV光源效率僅4%。
      3. 戰略目標限於軍事需求，非商業競爭。

3. GaAs-on-Si晶片風險​

  • 核心議題：有毒材料與低實用性
    • 細節：
      1. 砷化鎵（GaAs）毒性高，處理不當危害健康。
      2. 技術未完成，無防靜電包裝，收藏價值低。

4. GlobalFoundries與聯電合併傳聞​

  • 核心議題：半導體產業整併趨勢
    • 細節：
      1. 中型廠商合併以對抗台積電主導地位。
      2. 地緣政治影響美台供應鏈合作。

5. 半導體工程師轉職困境​

  • 核心議題：職業倦怠與轉型挑戰
    • 細節：
      1. 高壓「fab monkey」工作導致身心耗竭。
      2. 轉行恐面臨薪資大幅下降。

6. 美中科技戰升級​

  • 核心議題：科技脫鉤與政策影響
    • 細節：
      1. 美國加強出口管制，中國加速國產替代。
      2. 特朗普可能重返政壇加劇不確定性。

7. Applied Materials面試準備​

  • 核心議題：專案經理職位面試技巧
    • 細節：
      1. 尋求iManufacturing部門面試經驗分享。

8. 博士求職困境​

  • 核心議題：學術轉業界障礙
    • 細節：
      1. 半導體器件博士四個月未找到工作。
      2. 履歷需凸顯學術成果與業界需求連結。

9. VLSI工程單調性討論​

  • 核心議題：工作內容創造性占比
    • 細節：
      1. 詢問重複性任務與問題解決的比例。

10. 台新電機學位比較​

  • 核心議題：教育資源與就業前景
    • 細節：
      1. 新加坡國際化高薪 vs. 台灣半導體研究強但低薪。

11. 台積電2奈米壟斷疑慮​

  • 核心議題：先進製程競爭格局
    • 細節：
      1. 三星、英特爾退出，台積電可能獨占2奈米市場。

12. 類比IC設計課程選擇​

  • 核心議題：職涯導向技能取捨
    • 細節：
      1. 半導體製程

文章核心重點​

  1. Rant: TSMC is just sweat shop. - 作者強烈批評台積電的高壓工作環境與血汗文化，擔憂其對工程師職涯的負面影響。
  2. Chip production: Russia builds i``` first own lithography systems - 俄羅斯在半導體技術（如EUV）上嚴重落後，受限於技術孤立與基礎薄弱。
  3. 2inch GaAs on Si wafer - 討論GaAs-on-Si晶片的低實用價值與潛在健康風險，建議謹慎處理。
  4. GlobalFoundries, Taiwanese chipmaker UMC consider merger, sources say - 全球半導體產業整合趨勢下，GlobalFoundries與聯電可能合併以強化競爭力。
  5. How to move out of the industry? - 一名半導體工程師因職業倦怠尋求轉型建議，權衡高薪與職涯滿足感。
  6. Daily: US-China tech war spirals; Trump cu``` BIS funding; Interview w Gelsinger - 美中科技戰升級，分析政策制裁、供應鏈重組與地緣政治影響。
  7. Applied Materials Project Manager Interview - 求職者尋求應用材料公司專案經理職位的面試準備建議與經驗分享。
  8. Struggling to Land My First Job in the Semiconductor Industry Need Advice & Resume Review - 半導體博士求職受阻，請求履歷優化與業界求職策略建議。
  9. Is VLSI engineering work monotonous? - 探討VLSI工程師工作中創造性與重複性任務的比例，評估職業適配性。
  10. Semiconductors - 比較台灣與新加坡大學電機工程學位的國際聲譽、課程設計與就業前景差異。
  11. Will TSMC be only with "2nm" class process node? - 分析台積電可能成為2奈米及更先進製程唯一供應商的市場壟斷潛力。
  12. ECE Masters of Science student with a focus on on Analog IC Design/Mixed-Signal Design trying decide final class to take before graduation asking for advice as to what to take since there are four classes that I am trying to decide between. - 碩士生尋求選課建議以最大化進入類比IC設計領域的競爭力。
  13. The CHIPS Act already pu``` America first. Scrapping it would poison the well for US investment - 主張「美國優先」政策應通過資金挹注強化本土半導體製造與就業。
  14. Doubt in metal-semiconductor Junction - 探討金屬-半導體接面的能帶彎曲機制與費米能級相對位置的物理矛盾。
  15. What happened to the OLED DDIC market and how viable is the power discrete / PMIC space? - 分析Magnachip因OLED市場衰退轉型功率半導體的挑戰與前景。
  16. Chip Industry Week In Review: 2nm GAA deal; high-density 3D DRAM; China blacklist expands; global fab equipment; interposers and substrates; managing chiplet resources and more - 綜述半導體產業週報，涵蓋技術進展、供應鏈動態與地緣政治。
  17. China's SiCarrier emerges as challenger to ASML, other chip tool titans - 討論中國SiCarrier挑戰ASML的技術壁壘，呼籲媒體報導需重視實證數據。
  18. Does having a varied background before a PhD make me a weaker candidate for future positions? - 作者擔憂跨領域學術背景是否影響博士研究與未來職涯競爭力。
  19. How is pragmatic semiconductor? - 探討柔性半導體技術的市場定位與相關工作經驗對職涯的長期影響。
  20. Power Semiconductor Gian``` amid Struggles: 8,800+ Layoffs as Market Slows and China Emerges - 美國制裁加速中國半導體自主化，迫使企業減少對外國晶片的依賴。
  21. Special Report: First-Time Silicon Success Plumme``` - 批評特定來源文章過度分享，呼籲內容篩選與多樣性。
  22. Completely clueless about semiconductor manufacturing - 初學者提問DRAM製造流程、環境影響及業界倫理標準等基礎知識。
  23. How do I get into learning in extreme detail about semiconductor equipment and tooling - 尋求半導體製造設備的詳細學習資源，涵蓋晶圓加工到封裝

目錄​

1. Rant: TSMC is just sweat shop.​

這篇文章的核心討論主題是：作者對台積電（TSMC）工作文化的強烈不滿與批評，主要聚焦於以下幾點：

  1. 高壓工作環境：
    作者將台積電在美國設廠的勞動條件比喻為「中國血汗工廠」，批評其極度苛刻的工作要求（如無休假日、不分晝夜的趕工），並以「現在或昨天」的急迫性壓榨員工。

  2. 對工程師職涯的負面影響：
    作者認為，台積電若壟斷市場，工程師將失去職場選擇權，導致公司可任意壓低薪資，形成惡性循環。

  3. 對東亞企業文化的批判：
    文中直指這種「割喉式競爭」（throat-cut culture）僅有利於台積電股東，卻犧牲員工權益，長期而言無人受益。

  4. 個人情緒宣洩：
    文章帶有強烈情緒，反映作者因工作壓力產生的挫折感，並透過「抱怨」（rant/vent）形式表達。

總結：作者透過自身經歷，抨擊台積電的高壓管理與短視競爭文化，並擔憂其對工程師職場生態的負面影響。

內容​

Got a really long day due to TSMC. Just a rant. It felt like TSMC to US fab is just like Chinese sweat shop to manufacturing in western countries. Jesus they work like there is no tomorrow. No weekend and no night, everything they want is either now or yesterday.

Fucking Christ don't they know if they beat all competitions, the engineers will be the next on chopping block? Like there will be no other companies to jump to. So TSMC can and will suppress the salary cost to the ti```!

This type of throat cut east asian culture make no winner, except the shareholders of TSMC.

Sorry just a rough day. Vent out.

討論​

評論 1:

Fab work in general is for the young. I'm glad I don't have to do it anymore.

Samsung was absolutely awful, I can't imagine TSMC being any better.

評論 2:

It's not just TSMC that's that demanding I work in an Intel (luckily not for them but for a vendor) fab and they are exactly the same.

評論 3:

Just curious , are you Taiwanese or American ? Cuz TSMC experience will mean a lot to them in coming years

評論 4:

Welcome to manufacturing!

評論 5:

Yeah man. It takes a certain kind of person to work in a fab for a long period. Im glad I did young when I entered the industry but super glad I dont work for the fab companies any more. I just go in there for time to time.

2. Chip production: Russia builds i first own lithography systems \{#2-chip-production-russia-builds-i-first-own-lit}​

這段討論的核心主題是俄羅斯在半導體技術（特別是極紫外光刻技術，EUV）上的落後現狀與發展限制，並透過與中國、美國、台灣等領先者的對比，凸顯以下重點：

  1. 技術落後與追趕難度

    • 俄羅斯缺乏外國技術支援（如中國過去曾享有的資源），當前僅能生產90奈米晶片（2007年水準），導彈使用40奈米技術，遠落後於全球先進製程（如5奈米、EUV）。
    • 即使中國投入巨資並涉入技術竊取，仍未能突破EUV門檻，凸顯俄羅斯追趕的困難。

  2. EUV技術的關鍵瓶頸

    • 討論提到俄羅斯研究機構嘗試開發EUV光源（如固態EUV源，轉換效率4%），但整體技術仍停留在1995年水準，且缺乏EUV掩模製造等關鍵能力。
    • 對比荷蘭ASML的領先地位，俄羅斯的技術被視為「非現代標準」。

  3. 戰略目標與現實限制

    • 俄羅斯的半導體發展並非以趕超中美台為目標，而是聚焦於滿足基本軍事與工業需求（如飛彈晶片）。
    • 地緣政治（如與西方關係惡化）切斷技術合作機會，加劇其自主研發的挑戰。

總結：討論強調俄羅斯在半導體領域的弱勢地位，並指出其受限於技術孤立、基礎薄弱及戰略取捨，短期內難以突破國際先進製程的壟斷格局。

內容​

You can buy stuff on ebay that is better than that. LOL Even China is stuck trying to squeeze 5nm chips out of DUV machines and they have had access to foreign technology up until recently. Russia has a long way to go without access to foreign technology like China had to try and catch up.

China, even with trillions in theft and billions in investment. Has yet to reach the EUV threshold. Russia has a long way to go. Is it as good as ASML ? Not great for modern standards but from what I checked it looks like theyre also trying to make an EUV litho like China. They made a solid state EUV source with 4% conversion efficiency at 11.2 nm, I think that paper also got an AIP rising star award iirc. Theyre still far behind though, especially with EUV mask making but the institute that made the EUV source have also made some paten``` for ASML before when relations were better. Yes, this is 1995 level tech. But per the article, Russia uses 40 nm for their missiles (2007) and can already make 90 nm stuff.

So yeah, they are not catching up to Taiwan/China/US any time soon. But theyre not trying to.

討論​

評論 1:

You can buy stuff on ebay that is better than that. LOL

評論 2:

Even China is stuck trying to squeeze 5nm chips out of DUV machines and they have had access to foreign technology up until recently. Russia has a long way to go without access to foreign technology like China had to try and catch up.

China, even with trillions in theft and billions in investment. Has yet to reach the EUV threshold. Russia has a long way to go.

評論 3:

Is it as good as ASML ?

評論 4:

Not great for modern standards but from what I checked it looks like theyre also trying to make an EUV litho like China. They made a solid state EUV source with 4% conversion efficiency at 11.2 nm, I think that paper also got an AIP rising star award iirc. Theyre still far behind though, especially with EUV mask making but the institute that made the EUV source have also made some paten``` for ASML before when relations were better.

評論 5:

Yes, this is 1995 level tech. But per the article, Russia uses 40 nm for their missiles (2007) and can already make 90 nm stuff.

So yeah, they are not catching up to Taiwan/China/US any time soon. But theyre not trying to.

3. 2inch GaAs on Si wafer​

這篇文章的核心討論主題可以總結為以下幾點：

  1. 物品的價值與用途：

    • 討論該物品（可能是GaAs-on-Si半導體晶片）作為半導體或收藏品的市場價值，但因缺乏歷史背景、技術細節（如電路設計、是否完成加工、是否有保護層）以及包裝不當（未防靜電），其實用性和收藏價值受到質疑。

  2. 技術挑戰與潛在風險：

    • 提到將砷化鎵（GaAs）沉積在矽（Si）基板上的技術難度，並暗示該物品可能僅適合作為裝飾品或紀念品。
    • 強調對物品的實際架構和狀態（如是否已完成加工）缺乏了解，限制了其應用可能性。

  3. 安全隱患與健康風險：

    • 重點警告砷化鎵（GaAs）中砷（As）成分的毒性，指出未經專業防護（如無層流設備）接觸此類材料可能導致吸入或攝入有毒顆粒，對自身及周圍人（如家人、寵物）造成健康威脅。
    • 建議謹慎處理甚至銷毀，因不明確材料的具體化合物形式可能加劇危險性。

核心結論：
文章主要圍繞該物品的技術不確定性、低實用價值，以及潛在的高健康風險展開，強烈呼籲重視安全問題而非試圖利用或收藏。

內容​

If you wanted to sell it as a semiconductor, probably $5. Nobody knows what it does, what the circuitry looks like.

As a collectors item or museum artifact? No idea, but probably also low since we dont know the history or provenance of this item. How do you even know it's really GaAs on Si. You'd have to do analysis on it to prove that's really what it is.

FWIW depositing epi GaAs on Si is not easy. I would like one for my desk. I doubt it would be useful for much other than a decoration at this point. Sell them to a museum's gift shop for souvenirs, Id pay for shipping for one or two Man, without actually knowing the architecture, you can't do anything with these.

Do you even know if they are finished?

Are they coated with a protective layer.

Also, they are not packaged in a non-static bag. So they could already be ruined.

If I were you, I would dispose of those carefully seeing Ga i```elf is not very dangerous , some compound can be. And since you don't really know what type of Ga you are dealing with.. I can tell you that the As part is fucking dangerous!!

Arsenide is nothing to fuck around with!

I work with this bi-weekly and we have special stickers to denote that GaAs is involved so we know what toso when a wafer breaks.

And we work under laminar flow, you are just sitting at your desk.

Just handling these can already produce particles that you inhale or family members/pe``` can inhale or ingest.

Not smart.

討論​

評論 1:

If you wanted to sell it as a semiconductor, probably $5. Nobody knows what it does, what the circuitry looks like.

As a collectors item or museum artifact? No idea, but probably also low since we dont know the history or provenance of this item.

評論 2:

How do you even know it's really GaAs on Si. You'd have to do analysis on it to prove that's really what it is.

FWIW depositing epi GaAs on Si is not easy.

評論 3:

I would like one for my desk. I doubt it would be useful for much other than a decoration at this point.

評論 4:

Sell them to a museum's gift shop for souvenirs, Id pay for shipping for one or two

評論 5:

Man, without actually knowing the architecture, you can't do anything with these.

Do you even know if they are finished? Are they coated with a protective layer.

Also, they are not packaged in a non-static bag. So they could already be ruined.

If I were you, I would dispose of those carefully seeing Ga i```elf is not very dangerous , some compound can be. And since you don't really know what type of Ga you are dealing with.. I can tell you that the As part is fucking dangerous!!

Arsenide is nothing to fuck around with!

I work with this bi-weekly and we have special stickers to denote that GaAs is involved so we know what toso when a wafer breaks.

And we work under laminar flow, you are just sitting at your desk.

Just handling these can already produce particles that you inhale or family members/pe``` can inhale or ingest.

Not smart.

4. GlobalFoundries, Taiwanese chipmaker UMC consider merger, sources say​

根據路透社的文章，核心討論主題是：

全球半導體產業的整合趨勢，具體聚焦於：

  1. GlobalFoundries與台灣聯電（UMC）潛在的合併談判，雙方考慮在2025年進行整合。
  2. 產業競爭與規模化需求：面對台積電（TSMC）等巨頭的市場主導地位，中型晶圓代工廠可能透過合併強化競爭力。
  3. 地緣政治與供應鏈影響：合併案涉及美台半導體企業合作，反映地緣經濟下的產業策略調整。

簡言之，文章探討的是半導體行業透過併購重組以應對市場集中化的動向，並隱含地緣政治因素對產業布局的影響。

內容​

連結： https://www.reuters.com/markets/deals/globalfoundries-taiwanese-chipmaker-umc-mull-potential-merger-nikkei-reports-2025-03-31/

討論​

無討論內容

5. How to move out of the industry?​

这篇文章的核心討論主題是：
一名半導體設備工程師對職業倦怠與轉型可能性的探討

具體要點如下：

  1. 職業現狀與矛盾：

    • 作者雖獲得同事好評且工作表現良好，但深感現職（晶圓廠設備維護）「消耗靈魂」，長期處於高壓（如擔憂機台停機、安全問題），產生職業倦怠。

  2. 轉職動機：

    • 希望擺脫「fab monkey」（對重複性技術工作的自嘲）的定位，尋求更具發展性或滿足感的職涯方向。

  3. 關鍵疑問：

    • 尋求轉型選項（如跨領域職位或產業），但顧慮轉職可能伴隨的薪資大幅下降（半導體廠的高薪與外部職位的落差）。

  4. 潛在需求：

    • 需要具體建議（如可轉換的職能、產業或技能提升方向），以平衡興趣（喜歡機械相關工作）與職業成長。

總結：文章聚焦於「高壓技術崗位的職業困境」與「轉型可能性之間的權衡」，並呼籲經驗分享與實用建議。

內容​

I've been an equipment engineer in the industry for a bit and I think I do a decent job (decent to good reviews, good opinions from coworkers), but holy hell can it be a soul sucking job. I like working on machines but I'd also like not feeling like I'm shackled to being a fab monkey for the rest of my career, always worried about down time or safety issues. What are my options to branch out, if you guys know any? I assume the pay cut can be pretty steep when moving out of fabs?

討論​

評論 1:

Equipment vendor side - e.g. equipment start-up engineer?

評論 2:

what do you mean by out of industry? out of semicon? or out of manufacturing?

if you want out of semicon, i``` relatively simple since semicon is the most stringent, any manufacturing will be glad to have you. i have seen colleagues transition to shipbuilding and light industry (manufacturing printers).

if you want out of manufacturing, you can leverage your knowledge on maintenance/leadership instead of machine knowledge and transition to civil engineering. Take care of facilities management like bridge, road, train station, etc. Settle for govt job.

6. Daily: US-China tech war spirals; Trump cu BIS funding; Interview w Gelsinger \{#6-daily-us-china-tech-war-spirals;-trump-cu-bis}​

根據提供的文章連結《Daily: US-China Tech War Spirals; Trump...》來自 Chip Briefing Substack，該文的核心討論主題應圍繞以下幾點：

  1. 美中科技戰升級：
    文章可能聚焦於近期美國與中國在科技領域（如半導體、AI、5G等）的競爭加劇，包括政策制裁（如出口管制、實體清單）、技術脫鉤，以及雙方在供應鏈自主化上的布局。

  2. 特朗普的潛在影響：
    若涉及美國前總統特朗普，可能分析其重返政壇的可能性（如2024大選）對美中科技戰的潛在衝擊，例如更強硬的關稅政策、科技封鎖，或與中國的談判策略變化。

  3. 全球供應鏈與產業動態：
    討論科技戰對全球半導體供應鏈、企業（如台積電、華為、中芯國際）的影響，以及各國（如歐盟、日韓）在美中對抗中的角色。

  4. 中國的反制措施：
    可能提及中國如何應對美國壓力，例如加速國產替代（如晶片自主）、推動技術標準（如RISC-V），或通過外交與市場手段反擊。

由於無法直接訪問原文，以上總結基於標題和Substack平台常見的美中科技戰內容推測。如需更精準分析，建議提供具體段落或補充文章細節。

內容​

連結： https://chipbriefing.substack.com/p/daily-us-china-tech-war-spirals-trump

討論​

無討論內容

7. Applied Materials Project Manager Interview​

這篇文章的核心討論主題是：
「尋求關於應用材料公司（Applied Materials）專案經理職位面試的建議與經驗分享」

具體要點包括：

  1. 目標職位：iManufacturing 業務部門的專案經理（Project Manager）。
  2. 需求內容：希望獲得面試準備的實用技巧，尤其是曾參與過該公司面試流程者的經驗分享。
  3. 背景情境：作者即將參加面試，主動尋求社群幫助以提高成功率。

總結：這是一篇針對特定企業（Applied Materials）及職位（iManufacturing PM）的面試準備求助文，重點在蒐集相關面試策略與第一手經驗。

內容​

I have an interview soon with Applied Materials for a project manager role in i``` manufacturing business unit. I would appreciate any tips from anyone who has gone through Applied Materials interview process.

Thank you.

討論​

無討論內容

8. Struggling to Land My First Job in the Semiconductor Industry Need Advice & Resume Review​

核心討論主題總結：​

  1. 求職困境：
    當事人擁有半導體器件領域的博士學位，並已完成博士後研究，但在畢業後四個月仍未能找到業界工作，尋求具體的求職建議。

  2. 履歷優化需求：
    當事人提供履歷連結（兩張圖片），希望獲得內容與格式上的反饋，以提升競爭力。

  3. 產業轉換挑戰：
    從學術（博士、博士後）過渡至業界（半導體行業）的求職策略調整，可能是討論的潛在重點，例如技能匹配、求職管道或自我行銷方式。

次要相關議題：​

  • 半導體產業的就業市場現狀與熱門職位需求。
  • 博士級人才在業界求職的常見障礙（如經驗不足或過度專精）。
  • 履歷中如何有效凸顯學術成果與業界需求的關聯性。

（註：由於提供的連結無法直接查看履歷內容，具體建議需基於實際履歷分析。）

內容​

I am trying to get my first job in the semiconductor industry. I did my PhD in Semiconductor Devices, and it has been four months since my postdoc, but I haven't been able to find another job. Could you give me some suggestions? Also, could you check my resume? Thank you.

https://preview.redd.it/nmyt581333se1.png?width=533&format=png&auto=webp&s=d443746c45dec5470cffa4974abfdd7a315aceca

https://preview.redd.it/58nps71333se1.png?width=508&format=png&auto=webp&s=41e88b3da1cbcde3c2118f756b1d68852ac46de4

討論​

評論 1:

OP, what companies have you tried?

評論 2:

Look into the toolmakers: KLA, LAM, Applied Materials

評論 3:

I can also recommend looking into "Applications Engineer" roles at ASML for example.

評論 4:

Reduce to one page. Combine experience and key projec, this should be the second section: particulars including work righ, experience including specific achievemen``` in each role, education, 'other things' like certifications last.

Understand that the jobs market for graduates right now is awful. Almost everyone is in a hiring freeze except for experienced hires. Just keep trying.

For people in their degrees checking this thread: this is one of the reasons you should enter industry as soon as possible, and I say that as someone who went the PhD route instead. In hard times, companies are more likely to hire a person with experience than a person with extra education.

9. Is VLSI engineering work monotonous?​

這篇文章的核心討論主題是：VLSI（超大規模積體電路）工程師的工作是否單調重複，以及其工作中創造性與重複性任務的比例。

作者是一位IT從業者，喜歡解決問題而不喜歡單調的工作，因此詢問：

  1. VLSI工程師的工作是否過於單調或重複？
  2. 這份工作中「單調任務」與「創造性任務」的占比大概是多少？

整體而言，這是一個關於職業選擇與工作內容性質的探討，聚焦於VLSI工程領域的日常職責是否適合偏好挑戰與解決問題的人。

內容​

Is VLSI engineering work monotonous? Currently, I am working in IT. I like to solve problems, I don't like monotonous work. Does VLSI engineer work too monotonous/repetitive, Can you tell me how much percentage is monotonous and creative?

討論​

評論 1:

Define whats monotonous for you?

評論 2:

If you plan to jump from IT to VLSI, you should have a BSEE at the very least, and know someone.

Most of that work is considerd IC digital design, and needs a masters+ from highly rated schools.

You are looking at very elite work.

The work is like recess all day.

You might be able to first go to board design and get some FPGA work or work hardening FPGA to ICs. But I have been out for a long while now, so the design flow may be different now.

Even that work is going to be very competitive.

10. Semiconductors​

以下為台灣與新加坡大學電機工程學士學位的核心比較主題總結：

1. 學術排名與國際聲譽​

  • 新加坡大學（如國立新加坡大學NUS、南洋理工大學NTU）：
    全球排名前列（QS/THE常居世界前20），工程領域聲譽高，國際化程度強。
  • 台灣大學（如台大、清大、交大）：
    亞洲區排名中上（QS多位於100-200名），電機領域在學術研究具競爭力，但國際能見度較新加坡略低。

2. 課程設計與專業方向​

  • 新加坡：
    • 偏重實用與產業結合（如半導體、通訊、AI），課程更新快，英語授課。
    • 提供跨領域選修（如商業、電腦科學），強調創新與創業。
  • 台灣：
    • 理論與實務並重，傳統強項在電力系統、IC設計、控制工程。
    • 部分課程以中文授課，研究導向明顯（如半導體實驗室資源豐富）。

3. 學費與獎學金​

  • 新加坡：
    • 學費較高（國際生年均約2.5-3.5萬新幣），但政府補助（Tuition Grant）可減免，需綁定當地工作3年。
    • 獎學金機會多（如ASEAN Scholarship）。
  • 台灣：
    • 學費低廉（年均約1.5-3萬台幣/本地生，國際生約3-5萬台幣），生活成本低。
    • 國際生獎學金較少（如台灣獎學金MOE）。

4. 產業連結與就業前景​

  • 新加坡：
    • 鄰近跨國企業（如半導體、金融科技），實習機會多，畢業生起薪高（年均4-6萬新幣）。
    • 政策支持留學生就業（如EP工作簽證）。
  • 台灣：
    • 科技業密集（台積電、聯發科等），校園徵才管道順暢，但起薪較低（年均40-60萬台幣）。
    • 國際生留台就業門檻較高（需符合專業需求）。

5. 語言與文化適應​

  • 新加坡：英語為主，多元文化環境，國際生適應較易。
  • 台灣：中文為主，部分課程需語言門檻（如華語考試），文化相近性對華語圈學生有利。

6. 研究資源與設備​

  • 兩地大學均具先進實驗室，但新加坡資金投入更集中於尖端領域（如量子計算），台灣則在半導體製程技術領先。

總結比較維度​

維度新加坡優勢台灣優勢
國際化高排名、英語環境、多元文化華語友善、低成本生活
就業高起薪、全球企業機會多本地科技業連結深、學費低廉
學術重點創新應用、跨領域整合理論扎實、半導體研究強項

核心討論主題：兩地大學在電機工程學位的差異，主要圍繞「國際聲譽 vs. 性價比」、「產業導向 vs. 研究深度」、「語言與就業市場」三大軸線的取捨。

內容​

compare Taiwan university and Singapore university with electrical engineering major (bachelor's degree)

討論​

無討論內容

11. Will TSMC be only with "2nm" class process node?​

這篇文章的核心討論主題是：台積電（TSMC）是否將成為「2奈米」及更先進製程技術的唯一供應商。

具體要點包括：

  1. 競爭對手的退出：三星（Samsung）取消相關計畫，英特爾（Intel）也放棄了20A及A18製程的推進，且目前未有明確進展。
  2. 市場壟斷的可能性：若其他半導體大廠未能跟進，台積電可能成為「2奈米」及更先進製程（如次2奈米）的唯一供應商，主導未來尖端晶片製造。

整體而言，文章探討的是先進製程技術的競爭格局變化，以及台積電在其中的潛在獨占地位。

內容​

Will TSMC be only with "2nm" class process node? After Samsung cancel it and Intel cancel 20A and A18 is still out of sight and there is no news about it will there left only one manufacter of "2nm" and sub 2nm process?

討論​

評論 1:

Are you saying Intel 18A isnt a 2nm process? Or are you saying chips wont actually be manufactured on 18A?

評論 2:

Samsung according to web articles is targeting 2nd half of 2025 for full scale production at 2nm. https://wccftech.com/samsung-could-beat-```mc-in-the-2nm-race/

Assuming they can find customers that will choose them over TSMC.

評論 3:

Only the three you mention will have the process capability to achieve 2nm and beyond. Intel will shift their focus on larger sizes and get manufacturing back to where it needs to be before investing millions in R&D to get to beyond 2nm (although ASML and Intel are very closely linked and some of the ASML development is done with Intel, but still doubt it will go into production soon). Only real rival will be Samsung, and if they are taking a step back, don't see anyone else going after it... Samsung will get there, but TSMC does appear to be miles ahead in terms of manufacturability at small scale.

評論 4:

Rapidus in Japan is aiming to be the main competitor to ```m for 2nm.

評論 5:

Yes, no doubt. They are too much advanced.

12. ECE Masters of Science student with a focus on on Analog IC Design/Mixed-Signal Design trying decide final class to take before graduation asking for advice as to what to take since there are four classes that I am trying to decide between.​

這段文字的核心討論主題是：
一位即將完成電子與電腦工程碩士學位的學生，如何選擇最有利的課程以進入「混合信號/類比IC設計」領域，並在求職時提升競爭力。

具體要點包括：

  1. 求職目標與背景：

    • 作者熱衷於類比IC設計，但也對數位信號處理（DSP）有興趣，目前無工程相關工作經驗，迫切希望進入該領域。
    • 碩士畢業前僅需再修一門課，需從四門選修課中選擇最符合職涯需求的課程。

  2. 課程選擇的考量：

    • 類比IC設計的直接相關性：如半導體製程實驗（EEE5354L）可能最貼近類比IC的實務技能。
    • 補充性技能：
      • 硬體安全（EEE5716）可能提升對IC安全議題的理解，但與類比設計關聯較間接。
      • 電腦架構（EEL5764）和可重配置計算（EEL5721）偏向數位IC/FPGA，雖非核心類比技能，但可擴展職涯備案（如轉向數位領域）。
    • 求職策略：擔心類比IC職缺有限，因此考慮學習FPGA相關課程作為備用計畫。

  3. 核心問題：

    • 在「直接相關知識」與「職涯彈性」之間權衡，尋求最優化的課程選擇建議。

總結：討論聚焦於「如何通過課程選擇最大化進入類比IC設計領域的機會」，同時兼備技能廣度以應對就業市場的不確定性。

內容​

By the way I did enjoy the DSP class a lot and I also like Digital Design, but I am hoping to get a job in Analog IC Design (a subject I greatly enjoy and I have found a passion in--I also absolutely love DSP stuff too). After this current semester, I will only need one class to graduate with my Masters in ECE. BTW, I am not employed in engineering at this time, so I am really trying to break in and get a chance at starting a career.

How would you rank these in terms of value for a person trying to find their way into a position as an Mixed-signal/analog IC designer?

The four classes that I am trying to decide between are

EEE5716 - Introduction to Hardware Security and Trust

Description: Fundamentals of hardware security and trust for integrated circui. Cryptographic hardware, invasive and non-invasive attacks, side-channel attacks, physically unclonable functions (PUFs), true random number generation (TRNG), watermarking of Intellectual Property (IP) blocks, FPGA security, counterfeit detection, hardware Trojan detection and prevention in IP cores and integrated circui.

EEE5354L - Semiconductor Device Fabrication Laboratory

This course will be offering hands-on experience in semiconductor material characterization and device fabrication techniques.

EEL5764 - Computer Architecture

Fundamentals in design and quantitative analysis of modern computer architecture and systems, including instruction set architecture, basic and advanced pipelining, superscalar and VLIW instruction-level parallelism, memory hierarchy, storage, and interconnec```.

EEL5721 - Reconfigurable Computing

Fundamental concep at introductory graduate level in reconfigurable computing based upon advanced technologies in field-programmable logic devices. Topics include general concep, device architectures, design tools, metrics and kernels, system architectures, and application case studies.

I know the FPGA/VLSI (Reconfigurable Computing) course is far away from Analog IC Design, but I figure getting better with and doing projec with VLSI (although I did that a bit as an undergrad) would be valuable when I encounter digital IC projec in this field, plus knowing FPGAs better may prove to be a good security in case I find it hard to find Analog IC jobs (which would be a bummer for me).

Thank you for the advice!

討論​

評論 1:

If you want to do design, do the fab course.

13. The CHIPS Act already pu America first. Scrapping it would poison the well for US investment \{#13-the-chips-act-already-pu-america-first-scrap}​

上述文章的核心討論主題可以總結為：

「美國優先」政策與國內產業發展的重要性，包括：

  1. 批評美國當前政策（可能指半導體產業）未真正落實「美國優先」，並質疑其效果。
  2. 呼籲加強本土製造能力，主張通過新法案或增加資金，確保投資僅流向美國企業（如提及公司 Wolfspeed）。
  3. 強調創造就業與產業回流，將供應鏈與工作機會帶回美國。
  4. 對特朗普任內未通過相關法案的遺憾，同時希望未來政策能更徹底地執行「美國優先」原則。

整體而言，討論聚焦於「經濟民族主義」與產業保護主義，主張通過政策手段強化美國本土競爭力。

內容​

It was gutted out of contempt. Childish You sweet summer child you think America first is what gutting its about? My hope is that it stays and that if Trump really wan``` it to be more America first then make a new bill with even more funding that can only go to American based companies. Yes we must build our in country capabilities. Buy $Wolf support wolfspeed. Build local , bring jobs back to USA. Yeah but it wasn't passed under Trump.

討論​

評論 1:

It was gutted out of contempt. Childish

評論 2:

You sweet summer child you think America first is what gutting its about?

評論 3:

My hope is that it stays and that if Trump really wan``` it to be more America first then make a new bill with even more funding that can only go to American based companies.

評論 4:

Yes we must build our in country capabilities. Buy $Wolf support wolfspeed. Build local , bring jobs back to USA.

評論 5:

Yeah but it wasn't passed under Trump.

14. Doubt in metal-semiconductor Junction​

核心討論主題總結：​

  1. 金屬與n型半導體接面（Schottky junction）的能帶彎曲機制

    • 探討如何決定「能量-距離曲線」（Energy vs. distance curve）中的能帶彎曲形狀，涉及接觸電位差、空間電荷區（depletion region）的形成，以及載子（電子與電洞）的重新分佈如何影響能帶結構。

  2. 費米能級（Fermi level）相對位置的物理意義

    • 當半導體的費米能級高於金屬時，是否意味著從半導體移出電子比從金屬更容易？此現象的直觀矛盾（因金屬通常被認為更容易釋放電子）引發對「功函數」（work function）、電子親和能（electron affinity）及界面電荷轉移動力學的深入討論。

補充說明：​

  • 問題1的關鍵在於接觸電位差與空間電荷區的電場分佈如何共同塑造能帶彎曲的具體形式。
  • 問題2的疑惑源於未考慮**界面能障（Schottky barrier）**的影響，即使半導體費米能級較高，金屬-半導體界面可能因能障而限制電子流動，需綜合功函數與電子親和能分析。

此討論本質上圍繞金屬-半導體接面的能帶理論及其非直觀的電子行為。

內容​

I was studying the junctions of metal and n type semiconductor.few thing are not clear to me

  1. how do they determine the shape bending in that Energy vs distance curve ?

  2. in the one of the case the fermi level of the semiconductor is higher than that of metal.Does not it mean it is easier to take out electrons from the semiconductor than from the metal? It feels a bit unusual to me .

討論​

評論 1:

The shape of the band bending (or potential ) comes out to be parabolic when you solve the Poisson equation. The fermi-level being higher in semiconductor means the carriers in semiconductor have on average higher energy than the metal so they can easily get transferred to the metal side leaving behind space charge in the semiconductor

15. What happened to the OLED DDIC market and how viable is the power discrete / PMIC space?​

這篇文章的核心討論主題是：
Magnachip在半導體產業的戰略轉型及其面臨的市場挑戰，具體聚焦於以下兩大方向：

  1. OLED DDIC業務的衰退與結構性問題

    • 探討Magnachip的OLED顯示驅動晶片（DDIC）業務從2020年佔營收60%暴跌至2024年15%的原因，包括：
      • 疫情期間28nm晶圓產能被高價值應用（如CPU/GPU）擠壓，導致供應短缺。
      • 客戶轉向更大供應商或自研（如三星），形成不可逆的市場流失。
      • 該市場可能已陷入低利潤、商品化的困境，未來結構性吸引力不足。

  2. Power業務（功率半導體與PMIC）的發展前景與挑戰

    • Magnachip將重心轉向功率分立元件（MOSFET/IGBT）與電源管理晶片（PMIC），但需釐清：
      • 該領域的實際成長潛力與利潤空間（如宣稱的30%毛利率是否可持續）。
      • 技術差異化可能性（類比/功率晶片不依賴先進製程，但需其他競爭優勢）。
      • 中型企業（如Magnachip）在集中化市場中的長期生存能力。

深層議題：

  • 半導體產業中，資源分配（如晶圓產能）如何影響中小型公司的市場定位。
  • 從「低毛利商品化市場」轉型至「高成長領域」的策略可行性與風險。

（附註：原文因部分內容缺漏，總結以可辨識的主要脈絡為準。）

內容​

I'm pretty much a newbie in the semiconductor sector and recently came across Magnachip. Some things stood out, and I'd appreciate any insigh``` from people more experienced in this space. If a different sub is more suitable for these questions, please me know.

Context:

  1. Magnachip's OLED DDIC business has absolutely collapsed and it's looking to get out of it (this has gone from close to 60% of i``` business in 2020 to 15% in 2024)

  2. They're shifting their focus entirely to their Power Business, which includses

    1. Power Discretes - MOSFETs and IGBTs produced in their own fab in Korea

    2. Power ICs / PMICs - used in OLED TVs, data center SSDs, and ESS. This is fabless. This business has also been declining in the last couple of years but they see a much bigger market, much higher growth rates, as well as much better margins (30% gross margins).

My questions are:

1) What exactly happened to OLED DDIC market, and why isn't it bouncing back?

My understanding / guess is that this business needs 28nm wafers and during Covid all the supply went to higher-value use cases so guys like Magnachip got no allocation. This meant they lost customers who either went to bigger players that could get allocation or brought it in-house (e.g., Samsung). Afterwards there was no need for these customers to go back to Magnachip. Is this market so commoditized and low-margin now that it's structurally unattractive going forward?

2) How attractive is the Power Discretes / PMIC space in the next 3-5 years? Magnachip pain``` a very rosy picture but is this really a high-growth space? I know analog/power design doesn't follow the same bleeding-edge node dynamics as digital, but is there real differentiation here? Are mid-sized players like Magnachip viable in this space over the medium to long term?

Any commen``` appreciated and feel free to DM.

討論​

評論 1:

I can't give you a great view into the PMIC space, but OLED DDIC I have some perspective on.

Magnachip was always a second supplier to Samsung SEC, which is dominated by SLSI. They never got into any of the premium (higher margin) produc (especially mobile). Even LG captive SiWorks did better breaking into China/Japan OLED. Now that Novatek and Himax are in to field too (along with some smaller Chinese suppliers) they have no chance ouide Korea and Samsung is narrowing their suppliers over the last few years. Frankly, it appeared from the ou```ide that Magnachip was unable to deliver DDI without support from SEC (who used them for internal pricing leverage).

Early on the OLED DDIC were all 40nm, because (ou```ide SLSI which had 28nm) that was where everyone else was stuck with the top/bottom poly decision they made, which limited HV to <6V when it turned out 8V data line DACs were needed for OLED. Now there are fully developed 28nm HV with PDKs at all the majors (TSMC, UMC, SMIC?) in addition to SLSI so they really have no advantage. Geopolitics isn't on their side either.

All I know about PMICs is high power SiC in China so probably not relevant.

16. Chip Industry Week In Review: 2nm GAA deal; high-density 3D DRAM; China blacklist expands; global fab equipment; interposers and substrates; managing chiplet resources and more​

根據 SemiEngineering 的文章《Chip Industry Week In Review》，其核心討論主題圍繞以下幾個半導體產業的關鍵動態：

  1. 半導體技術進展與挑戰

    • 討論最新製程技術（如先進封裝、3D IC）的發展，以及產業在摩爾定律放緩下的創新方向。
    • 涉及材料科學（如新型電晶體材料）、功耗優化，以及製造過程中的良率挑戰。

  2. 供應鏈與產能問題

    • 分析全球晶片短缺的持續影響，包括晶圓廠擴產、地緣政治因素（如各國補貼政策）對供應鏈的影響。
    • 探討汽車、消費電子等行業的需求波動與產能分配。

  3. AI 與高效能運算（HPC）的驅動作用

    • 強調 AI/ML 晶片（如 GPU、TPU）的需求增長，以及數據中心對半導體技術的推動。
    • 提及邊緣運算和低功耗設計的趨勢。

  4. 產業合作與競爭

    • 報導企業間的合作（如代工廠與設計公司的夥伴關係）與市場競爭動態（如 Intel 與台積電的先進製程競逐）。
    • 可能涵蓋專利戰或標準化議題。

  5. 政策與地緣政治因素

    • 簡述各國政策（如美國 CHIPS 法案、歐盟補貼）對產業佈局的影響，以及全球化的供應鏈風險管理。

總結：文章的核心主題是「半導體產業在技術創新、供應鏈重組及地緣政治下的動態發展」，聚焦於技術突破、市場需求與全球競爭格局的交互影響。

內容​

連結： https://semiengineering.com/chip-industry-week-in-review-79/

討論​

無討論內容

17. China's SiCarrier emerges as challenger to ASML, other chip tool titans​

这篇文章的核心討論主題圍繞以下幾點：

  1. ASML的技術護城河（競爭優勢）：
    強調ASML在極紫外光刻（EUV）技術領域的領先地位，其技術壁壘（"moat"）比其他半導體設備公司（如LAM Research、應用材料AMAT）更為穩固。

  2. 中國自主研發EUV機器的進展：
    提及中國在開發本土EUV技術的預期進展，並對相關消息的出現表示不意外，暗示這符合長期預期。

  3. 對媒體報導的批判性觀點：
    呼籲記者在討論技術突破時需優先考量「規模化良率」（yield at scale）等實際生產指標，而非輕信未經證實的負面消息（FUD，Fear, Uncertainty, Doubt）。

  4. 短期未來動向的觀察：
    表達對後續發展的關注，尤其是中國EUV技術的實際成果與產業影響。

總結：文章聚焦於ASML的技術優勢、中國半導體設備的自主化進程，以及對媒體報導應更具實證性的批評。核心議題是半導體製造設備領域的競爭格局與技術門檻。

內容​

The ASML moat is pretty big, LAM, AMAT, not so much. Journo's need to mention yield at scale before any FUD should be taken seriously Interesting! Lets see in a short future what is going on. It was expected that China would have i``` own EUV-based machines. Not very surprised. Actually I was wondering when we would see this kind of news

討論​

評論 1:

The ASML moat is pretty big, LAM, AMAT, not so much.

評論 2:

Journo's need to mention yield at scale before any FUD should be taken seriously

評論 3:

Interesting! Lets see in a short future what is going on. It was expected that China would have i``` own EUV-based machines. Not very surprised. Actually I was wondering when we would see this kind of news

18. Does having a varied background before a PhD make me a weaker candidate for future positions?​

這篇文章的核心討論主題是：

作者對其學術背景多樣性（跨領域轉換）的擔憂，以及這是否會影響其博士研究和未來職業發展。

具體焦點包括：

  1. 學術軌跡的不連貫性：

    • 作者過去的研究集中在材料科學（如薄膜沉積與表徵），但博士將轉向半導體器件測試與建模，擔心這樣的轉換是否會顯得背景「過於分散」。

  2. 選擇博士的疑慮：

    • 因簽證限制被迫接受與原計畫不同的碩士論文題目，導致研究方向與博士不完全銜接，甚至考慮是否應放棄博士機會。

  3. 未來競爭力的擔憂：

    • 擔心過往的材料科學經驗在博士後求職時是否無用，或是否會因「非線性」學術路徑而弱於背景一致的競爭者。

  4. 對導師與團隊的正面考量：

    • 儘管有疑慮，作者欣賞博士團隊與導師的評價，這成為堅持的動力之一。

總結而言，文章反映了跨領域學術轉換者的常見焦慮，並探討如何權衡「多元背景的潛在優勢」與「專業連貫性的傳統期望」。

內容​

Hi guys,

I will be starting a PhD next year. What I'm struggling with is that I feel like my CV is too incoherent. I have good grades and have done research internships at okay/good labs, but I feel like I jumped too much between topics. My PhD will be completely different from my master's thesis.

They were almost all in the semiconductors field, but all my previous research was in the materials science side, with a strong focus on thin films deposition and characterisation, and what I'm doing for my thesis is even more fabrication and characterisation. However, my PhD will be more about semiconductor device testing and modellingcompletely different from the structural characterisation I'm used to.

The story is a bit odd, but I actually wanted to move toward this area. However, I secured the PhD while I was still actively looking for a master's thesis topic. At some point, as an international student, I had to take what was available due to visa constrain```, and that ended up being another materials science projectjust like my bachelor's thesis.

Now, my concern is whether this makes my profile too inconsistent. I already have five years of experience in materials science, and now I'll be shifting to semiconductor device testing for my PhD. In my PhD interview, they even mentioned that my background seemed broad (just looking at my bachelor thesis and master courses).

I'm starting to second-guess my PhD choice, wondering if I should drop out before even starting. But I really like the group, and my supervisor has great reviews from his studen (which I know is important, given all the horror stories about bad supervisors when talking to PhD studen).

Will my pre-PhD background be useless when applying for research positions later? Does this kind of varied path make me a weaker candidate compared to those with a more linear trajectory from master's thesis to PhD?

I'd love to hear your though``` and experiences. Thanks!

討論​

評論 1:

No one is going to care about the projec``` you did before your PhD unless you care about it.

Honestly, even the specifics of your PhD don't much matter unless you're trying to get into a very specific field of process or tool research. For example, doing an optics project will really help for a lithography optics position.

My PhD was in PVD of magnetic metals. I did work in PVD for a while, but now all my Metals support work is in thermal ALD. I haven't worked on a real PVD tool in five years.

評論 2:

In the short term? Not a problem, as others commented, the company doesn't care much and they will teach you all you need to know from scratch. In the long term? This will be your asset to have a more diverse experience.

評論 3:

Once you enter a company, you will need to learn everything from start. So I dont think its a big problem.

評論 4:

Dude, what you have done and going to do in your PhD are all relevant for the semiconductor industry. If youre a fresh college grad, you will be lapped up by the foundries as cheap labor. Ive seen my company hire a ton of psych majors who dont even know what silicon is, as equipment and process techs, and theyve gone on to become middle management. As a young grad entering the field you have good prospec```. Youre worrying too much.

評論 5:

I did organic synthesis in undergrad and do pure semiconductor physics for my PhD

19. How is pragmatic semiconductor?​

這段討論的核心主題可以總結為以下兩點：

  1. 技術的應用與市場定位：

    • 討論聚焦於某公司開發的「柔性半導體」（flexible semiconductors）技術，並推測其可能應用於穿戴式裝置（wearable devices）。
    • 探討該技術的「小眾性」（niche）程度，即是否屬於高度專業化或具備廣泛市場潛力。

  2. 職涯發展的潛在影響：

    • 提問者關心在該公司獲得的經驗，是否會限制未來進入其他大型企業（big players）的機會，即專業技術的「可轉移性」與業界吸引力。

整體而言，討論圍繞「柔性半導體技術的市場特殊性」與「相關工作經驗對職涯的長期影響」兩大方向。

內容​

Ive researched a little and found that they are doing flexible semiconductors. Its probably for wearable devices.

How niche is their technology? Will the experience there make me less attractive to other big players?

討論​

評論 1:

Flexible electronics has been coming for the last 15 to 20 years . a lot of great work but not yet in a mainstream. However, moving forward in the hypecycle curve. Some mobile device players have recently introduced foldable mobile devices. Lets see how they perform.

評論 2:

i only know about flexible solar cells. i think i``` probably quite niche because why would you do the extra work to make something flexible in a car, smartphone, pc etc.?

評論 3:

Pragmatic is aimed at low cost electronics - NFC/RFID on mass market goods. Technology is niche, but the manufacturing process uses the same tools and process steps as conventional silicon process.

評論 4:

If it's something really simple, sure. If you want memory and logic, then you will still need solid silicon in a rigid package. But that can be a very small package on a flexible printed circuit assembly.

20. Power Semiconductor Gian amid Struggles: 8,800+ Layoffs as Market Slows and China Emerges \{#20-power-semiconductor-gian-amid-struggles-8-80}​

The core discussion topic of the article is the shift in China's semiconductor industry toward self-sufficiency due to U.S. sanctions, which have made reliance on foreign chips risky and unpredictable.

Key points include:

  1. Pre-sanction reliance on foreign chips – Chinese companies previously preferred foreign semiconductors for better quality and service.
  2. Post-sanction risks – U.S. export controls now threaten businesses dependent on foreign chips, as political decisions (e.g., POTUS policies) can disrupt supply chains.
  3. Forced self-sufficiency – The bans have pushed China to develop its own semiconductor capabilities to avoid vulnerabilities.
  4. Sarcastic tone – The phrase "No one could see this coming!" implies that the U.S. sanctions were a predictable consequence of geopolitical tensions.

Overall, the text highlights how U.S. restrictions are accelerating China's drive for semiconductor independence.

內容​

US chip bans leave China no other alternatives but to be self-sufficient in all types of semiconductors. Before the sanction, system integrators in China prefer foreign chips for better quality and service. Today, using foreign chips in China carries many risks and uncertainties. If your business relies on foreign semiconductors, POTUS can decimate your business with a strike of a pen. Oh my. No one could see this coming!

討論​

評論 1:

US chip bans leave China no other alternatives but to be self-sufficient in all types of semiconductors. Before the sanction, system integrators in China prefer foreign chips for better quality and service. Today, using foreign chips in China carries many risks and uncertainties. If your business relies on foreign semiconductors, POTUS can decimate your business with a strike of a pen.

評論 2:

Oh my. No one could see this coming!

21. Special Report: First-Time Silicon Success Plumme```​

The core discussion topic of the article revolves around the frustration or concern over the excessive sharing or posting of articles from a specific website, questioning the necessity or value of such frequent posts and possibly calling for moderation or limits on this behavior. The underlying themes may include content quality, redundancy, spam-like behavior, or the need for more diverse or selective sharing in the given context (e.g., a forum, social media group, or community platform).

In short: A critique of overposting articles from one source and a call for more mindful content sharing.

內容​

Can we stop posting every single article from this website

討論​

評論 1:

Can we stop posting every single article from this website

22. Completely clueless about semiconductor manufacturing​

這篇文章的核心討論主題是：
「半導體製造（尤其是DRAM生產）的基礎知識與相關議題」，具體包含以下三個面向：

  1. DRAM生產的工廠類型與分工

    • 提問者想了解DRAM製造過程中涉及的工廠類別（如晶圓廠、封裝測試廠等）及其差異。

  2. 半導體製造的化學與環境問題

    • 探討晶圓廠（fabs）在生產過程中使用的化學物質、廢棄物處理，以及對環境的潛在影響。

  3. 行業內的倫理與企業責任

    • 詢問是否存在更符合倫理標準的半導體製造公司，或業界是否對特定企業有偏好（如勞工權益、環保實踐等）。

總結：文章聚焦於半導體產業的技術流程、環境風險及企業社會責任，反映初學者對該領域的基礎認知需求。

內容​

Hi everyone! I was hoping people could answer some questions regarding semiconductor manufacturing as I am completely clueless as to what even look up to get the answers I need.

-What are the different factories regarding making DRAM? Are there even different ones?

-What are the chemical and environmental concerns with "fabs"?

-Are there more ethical companies in regards to manufacturing that are the "standard" or "prefered" in this industry?

Thank you

討論​

評論 1:

I think you might be interested in the YT channel "Asianometry," you will likely find all your answers there.

評論 2:

Those are very deep topics, but as a starting point:

There are three major DRAM manufacturers: Samsung, SK Hynix, and Micron. Competition is very fierce and the margins are very thin. There are also some smaller DRAM manufacturers working with older technology, particularly in China.

The main concerns of fabs is that they use a lot of electricity (equivalent to a small town) and a lot of water (about a million gallons a day), although a lot of that is now recycled. They certainly use a lot of hazardous chemicals in production, but there is not a lot of toxic waste produced. There are some concerns of, for example, increased levels of copper in waste water, but they are on the whole much cleaner than other heavy industries.

Not really. Samsung and SK Hynix are both South Korean, and although there are differences I dont think either is more ethical. Micron as a US company has a different culture (and some would say better work environment), but in the end its a very competitive environment.

評論 3:

DRAM is a product, just like orange juice and cereal. Actually, its more accurate to say that DRAM is a product like smartphones or luxury handbags. Smartphones or handbags are the product type and very specific companies are making their own brands and the industry is hard to break into. Each company that makes their own DRAM have the silicon part (grossly oversimplifying) made at a semiconductor foundry and then they add the packaging around it to make the chip connect to other computer par```. There are probably 40 foundry companies or less worldwide and you could easily google/wiki where the companies have their foundries/fabs located. There are probably less than 50 DRAM companies and you could probably also google where they have their factories.

What environmental concerns do you have? Environmental concern encompasses a lot of different issues. One major concern about fabs is that they use a lot of electricity and could stress the water security of their local region. While fabs are generally (in the widest sense of the word) not as heavily polluting as other chemical or material intensive industries, the chemicals that they use come from non-renewable sources, many of the ones used in smaller quantities come from substances that have to be mined. Fabs use lo``` of hazardous chemicals and substances but it seems like most fabs have introduced downstream recycling/recovery steps because these hazardous materials can be expensive to purchase.

In terms of ethical, again, what are you concerned about? Heavy pollution? Slave labor? Human righ``` abuses? Monopolistic behaviors? Engaging in bribery or corruption? Discriminatory or racist? Displacing indigenous peoples and cultures? Use GMOs or use gluten? Advocating anti-vaccine policies? Like, how crunchy is your definition of ethical on a scale of Wall street ESG to free-love on a commune?

At the end of the day, the semiconductor industry is a commercial endeavor. The companies may engage in morally questionable or downright illegal behavior. They may also try to do good things to gain social capital and positive marketing.

Your questions are not ones that people in the industry think about regularly. Its an incredibly competitive industry and making par``` like DRAM is insanely technical and complex. This isnt an industry with that many companies, so there are limited alternatives. If someone has a problem with the practices of TSMC, Intel, and Samsung and are personally boycotting them, they better prepare for a future of 40 year+ or lower end electronics, or just live off the grid.

評論 4:

I see you already have the asianometry YouTube suggestion.

This YouTube channel also has good content.

To get into such specific topic as memory it really depends how technical you want to get though. Both the channels above require little to no background in physics, chemistry or engineering but of course an in-depth study of these topics does.

評論 5:

Obligatory

https://youtu.be/vuvckBQ1bME?si=_Lt8zfwvLgwatj8y

23. How do I get into learning in extreme detail about semiconductor equipment and tooling​

The core discussion topic of your request is:

"Comprehensive learning resources for understanding the components and subsystems of semiconductor manufacturing equipment across the entire supply chain, from wafer processing (cleaning, etching, etc.) to packaging and testing."

You're seeking detailed references—such as books, courses, technical documents, or industry reports—that break down the machinery, technologies, and processes involved at each stage of semiconductor production.

Suggested Resource Categories:​

  1. Textbooks & Technical Guides

    • "Fundamentals of Semiconductor Manufacturing and Process Control" by Gary S. May & Costas J. Spanos
    • "Semiconductor Manufacturing Technology" by Michael Quirk & Julian Serda

  2. Industry Reports & Whitepapers

  3. Online Courses & Videos

    • Coursera: "Semiconductor Fabrication" (Purdue University)
    • YouTube: Applied Materials, Lam Research, or TEL (Tokyo Electron) often publish equipment breakdowns.

  4. Manufacturer Documentation

    • Check ASML (lithography), KLA (metrology), or Teradyne (testing) for equipment manuals/webinars.

  5. Government/University Resources

    • NIST publications on semiconductor tech (nist.gov).
    • MIT OpenCourseWare – Microelectronics processing lectures.

Would you like resources focused on a specific stage (e.g., etching, deposition) or equipment type (e.g., steppers, bonders)?

內容​

What are the best resources to specifically learn about all the componen``` of subsystems of semiconductor manufacturing equipment on every step of the semiconductor supply chain from wafer cleaning and etching to packaging and testing equipment?

Just link me as many detailed resources as possible

討論​

評論 1:

Ytho. These details get outdated the moment they're published, and the people who actually know anything go to great lengths to hide what they actually know, because of competitive advantage. There's no war thunder forums for semicon. Nobody's interested in bragging about the details. Probably easier if you were to just join a semicon firm and learn from the bottom up. Or, if you just wanna pretend you know something and don't want to sound completely stupid when making small talk with an insider, the Asianometry channel on YouTube is a good place to start.

評論 2:

The shortest way is to work for a semiconductor manufacturing company as an equipment engineer and to spend about two years at each module.

This information is not freely available because its not only the lifeline of the semiconductor manufacturers, but also the lifeline of the tool vendors. Its not common for a person to know more than their module unless they have worked in more than one module. Its fairly hard to find someone who even knows the details of their modules application in both FEOL and MEOL/BEOL.

Also, knowing the details on manufacturing tools is half of the equation. Learning the process parameters and how to detect the defec``` associated with each process stage/module is equally important to understand how a chip is made, much less making a chip.

Unless you know people at multiple semi tool companies who are willing to give you all of their companys intellectual property or spend years working in a fab, the best you can do are the online manufacturing lectures that give the basics of each module and are likely at minimum a decade out of date.

If youre applying for a semi equipment job, just apply with a relevant engineering/science background and be able to talk in detail about all the items on your resume. These companies know that no amount of education can prepare anybody they hire for what the job they are about to do. The only thing that helps is prior job experience.

評論 3:

Its quite literally impossible. Someone who works at a major vendor like myself will know the componen``` of my tool and maybe a few other similar tools, but Im clueless as to the majority of the other tools. I can tell you for a fact that the chip manufacturers are generally clueless to our tools, but they know some integration. And then we know very little of the integration overall. All of this information is also extremely proprietary, from the equipment to the manufacturing. Questions like this make me wonder if people think making a chip is like making a burger

評論 4:

It takes 2 years to train a good ion implant equipment technician.

評論 5:

Unfortunately theres no easy book thats going to give you knowledge in this industry. It takes years to learn and hands on is mandatory. Equipment exper``` take years to build their expertise and once they have it becomes sort of a career for them.

Nobody knows it in extreme detail. It takes a group of engineers working with vendors and customers on the different tools to get a process working properly. Believe it or not, theres still a lot of trial and error.

24. What Exactly Are Chiple And Heterogeneous Integration \{#24-what-exactly-are-chiple-and-heterogeneous-in}​

這篇文章的核心討論主題圍繞以下幾點：

  1. 「Chiple」是否帶有歧視性：
    作者質疑「Chiple」一詞的語意是否構成侮辱性用語（slur），引發對其社會敏感度的討論。

  2. 定義與語義的爭議：
    文中提到「無止境的定義與語義之爭」（never ending story about definitions and semantics），反映對詞彙精確意義的辯論，尤其涉及學術或專業背景的複雜解讀。

  3. 學術菁英的批判：
    透過「太多聰明且具學術背景的人」（too many, too smart people with academic backgrounds）的諷刺，可能暗示過度分析或脫離現實的語義討論，或對知識分子話語權的質疑。

  4. 「CAMTEK」的突兀提及：
    該詞以大寫及驚嘆號強調，可能指涉特定事件、組織或技術（如半導體檢測公司Camtek），但缺乏上下文下，其關聯性不明，推測為作者情緒性呼籲或轉移焦點的標的。

總結：
文章核心在批判語言使用的敏感性與學術化語義爭論，同時隱含對特定群體或現象（如Camtek）的不滿，整體帶有諷刺與焦慮的語氣。

內容​

Chiple``` sounds like a slur The never ending story about definitions and semantics too many, too smart people with academic backgrounds. CAMTEK!!!!!!!!

討論​

評論 1:

Chiple``` sounds like a slur

評論 2:

The never ending story about definitions and semantics too many, too smart people with academic backgrounds.

評論 3:

CAMTEK!!!!!!!!

總體討論重點

以下是24篇討論重點的條列式總結，並附上對應的文章錨點連結與逐條細節：

1. 台積電血汗工廠爭議​

  • 核心議題：批評台積電高壓工作文化
    • 細節：
      1. 美國廠區勞動條件被比擬為「血汗工廠」，工時長且無休假日。
      2. 擔憂市場壟斷導致工程師職涯選擇受限。
      3. 批判東亞「割喉式競爭」文化僅利股東，犧牲員工權益。

2. 俄羅斯半導體技術落後​

  • 核心議題：俄國EUV技術發展困境
    • 細節：
      1. 僅能生產90奈米晶片（落後國際15年）。
      2. 缺乏ASML級設備，EUV光源效率僅4%。
      3. 戰略目標限於軍事需求，非商業競爭。

3. GaAs-on-Si晶片風險​

  • 核心議題：有毒材料與低實用性
    • 細節：
      1. 砷化鎵（GaAs）毒性高，處理不當危害健康。
      2. 技術未完成，無防靜電包裝，收藏價值低。

4. GlobalFoundries與聯電合併傳聞​

  • 核心議題：半導體產業整併趨勢
    • 細節：
      1. 中型廠商合併以對抗台積電主導地位。
      2. 地緣政治影響美台供應鏈合作。

5. 半導體工程師轉職困境​

  • 核心議題：職業倦怠與轉型挑戰
    • 細節：
      1. 高壓「fab monkey」工作導致身心耗竭。
      2. 轉行恐面臨薪資大幅下降。

6. 美中科技戰升級​

  • 核心議題：科技脫鉤與政策影響
    • 細節：
      1. 美國加強出口管制，中國加速國產替代。
      2. 特朗普可能重返政壇加劇不確定性。

7. Applied Materials面試準備​

  • 核心議題：專案經理職位面試技巧
    • 細節：
      1. 尋求iManufacturing部門面試經驗分享。

8. 博士求職困境​

  • 核心議題：學術轉業界障礙
    • 細節：
      1. 半導體器件博士四個月未找到工作。
      2. 履歷需凸顯學術成果與業界需求連結。

9. VLSI工程單調性討論​

  • 核心議題：工作內容創造性占比
    • 細節：
      1. 詢問重複性任務與問題解決的比例。

10. 台新電機學位比較​

  • 核心議題：教育資源與就業前景
    • 細節：
      1. 新加坡國際化高薪 vs. 台灣半導體研究強但低薪。

11. 台積電2奈米壟斷疑慮​

  • 核心議題：先進製程競爭格局
    • 細節：
      1. 三星、英特爾退出，台積電可能獨占2奈米市場。

12. 類比IC設計課程選擇​

  • 核心議題：職涯導向技能取捨
    • 細節：
      1. 半導體製程